3D Microelectronic Packaging

From Fundamentals to Applications

Nonfiction, Science & Nature, Technology, Material Science, Electronics
Cover of the book 3D Microelectronic Packaging by , Springer International Publishing
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9783319445861
Publisher: Springer International Publishing Publication: January 20, 2017
Imprint: Springer Language: English
Author:
ISBN: 9783319445861
Publisher: Springer International Publishing
Publication: January 20, 2017
Imprint: Springer
Language: English

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. 

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. 

More books from Springer International Publishing

Cover of the book The Teachings of Management by
Cover of the book Antioxidants and Antioxidant Enzymes in Higher Plants by
Cover of the book Spark Plasma Sintering of Materials by
Cover of the book Perioperative Considerations and Positioning for Neurosurgical Procedures by
Cover of the book Rethinking Entrepreneurial Human Capital by
Cover of the book Advanced Intelligent Systems for Sustainable Development (AI2SD’2018) by
Cover of the book Gay Mental Healthcare Providers and Patients in the Military by
Cover of the book Environment Exposure to Pollutants by
Cover of the book Programming Language Concepts by
Cover of the book Cyclostationarity: Theory and Methods by
Cover of the book The Vegetation of the Iberian Peninsula by
Cover of the book Democratic Socialism and Education: New Perspectives on Policy and Practice by
Cover of the book Water and Power by
Cover of the book Fatigue and Fracture of Fibre Metal Laminates by
Cover of the book Modification of K0s and Lambda(AntiLambda) Transverse Momentum Spectra in Pb-Pb Collisions at √sNN = 2.76 TeV with ALICE by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy