5G and E-Band Communication Circuits in Deep-Scaled CMOS
Nonfiction, Science & Nature, Technology, Electronics, Circuits, Computers, Advanced Computing, Engineering, Computer Architecture
| Author: | Marco Vigilante, Patrick Reynaert | ISBN: | 9783319726465 |
| Publisher: | Springer International Publishing | Publication: | February 7, 2018 |
| Imprint: | Springer | Language: | English |
| Author: | Marco Vigilante, Patrick Reynaert |
| ISBN: | 9783319726465 |
| Publisher: | Springer International Publishing |
| Publication: | February 7, 2018 |
| Imprint: | Springer |
| Language: | English |
This book discusses design techniques, layout details and measurements of several key analog building blocks that currently limit the performance of 5G and E-Band transceivers implemented in deep-scaled CMOS. The authors present recent developments in low-noise quadrature VCOs and tunable inductor-less frequency dividers. Moreover, the design of low-loss broadband transformer-based filters that realize inter-stage matching, power division/combining and impedance transformation is discussed in great detail. The design and measurements of a low-noise amplifier, a downconverter and a highly-linear power amplifier that leverage the proposed techniques are shown. All the prototypes were realized in advanced nanometer scaled CMOS technologies without RF thick to metal option.
This book discusses design techniques, layout details and measurements of several key analog building blocks that currently limit the performance of 5G and E-Band transceivers implemented in deep-scaled CMOS. The authors present recent developments in low-noise quadrature VCOs and tunable inductor-less frequency dividers. Moreover, the design of low-loss broadband transformer-based filters that realize inter-stage matching, power division/combining and impedance transformation is discussed in great detail. The design and measurements of a low-noise amplifier, a downconverter and a highly-linear power amplifier that leverage the proposed techniques are shown. All the prototypes were realized in advanced nanometer scaled CMOS technologies without RF thick to metal option.
