Advanced Materials for Thermal Management of Electronic Packaging

Nonfiction, Science & Nature, Technology, Material Science, Electronics, Circuits
Cover of the book Advanced Materials for Thermal Management of Electronic Packaging by Xingcun Colin Tong, Springer New York
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Xingcun Colin Tong ISBN: 9781441977595
Publisher: Springer New York Publication: January 5, 2011
Imprint: Springer Language: English
Author: Xingcun Colin Tong
ISBN: 9781441977595
Publisher: Springer New York
Publication: January 5, 2011
Imprint: Springer
Language: English

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

More books from Springer New York

Cover of the book Diffuse Lung Disease by Xingcun Colin Tong
Cover of the book Approximation Theory and Harmonic Analysis on Spheres and Balls by Xingcun Colin Tong
Cover of the book Astrostatistical Challenges for the New Astronomy by Xingcun Colin Tong
Cover of the book Graphene for Transparent Conductors by Xingcun Colin Tong
Cover of the book Disaster Preparedness for Seniors by Xingcun Colin Tong
Cover of the book Smart Multicore Embedded Systems by Xingcun Colin Tong
Cover of the book MotionCast for Mobile Wireless Networks by Xingcun Colin Tong
Cover of the book Ribonuclease P by Xingcun Colin Tong
Cover of the book HIV/AIDS Treatment in Resource Poor Countries by Xingcun Colin Tong
Cover of the book Novel Developments in Stem Cell Mobilization by Xingcun Colin Tong
Cover of the book The Wondrous Story of Anesthesia by Xingcun Colin Tong
Cover of the book Clinical Care Pathways in Andrology by Xingcun Colin Tong
Cover of the book Corneal Biomechanics and Refractive Surgery by Xingcun Colin Tong
Cover of the book Flow Boiling in Microgap Channels by Xingcun Colin Tong
Cover of the book Liver Anesthesiology and Critical Care Medicine by Xingcun Colin Tong
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy