Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Nonfiction, Science & Nature, Science, Chemistry, Physical & Theoretical, Technology, Material Science
Cover of the book Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by , Springer New York
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9780387958682
Publisher: Springer New York Publication: September 19, 2009
Imprint: Springer Language: English
Author:
ISBN: 9780387958682
Publisher: Springer New York
Publication: September 19, 2009
Imprint: Springer
Language: English

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

More books from Springer New York

Cover of the book The Craft of Scientific Writing by
Cover of the book Introduction to Global Optimization Exploiting Space-Filling Curves by
Cover of the book Information Theory and Best Practices in the IT Industry by
Cover of the book Rational Homotopy Theory and Differential Forms by
Cover of the book Advanced Quantum Mechanics by
Cover of the book Sourcebook of Paleolithic Transitions by
Cover of the book Reviews of Environmental Contamination and Toxicology by
Cover of the book Practical Manual of In Vitro Fertilization by
Cover of the book South Asian Mammals by
Cover of the book Gastrointestinal Surgery by
Cover of the book Impact of Genetic Targets on Cancer Therapy by
Cover of the book Regenerative Biology of the Eye by
Cover of the book Mobile Speech and Advanced Natural Language Solutions by
Cover of the book The Bethesda System for Reporting Cervical/Vaginal Cytologic Diagnoses by
Cover of the book Gene-Environment Interplay in Interpersonal Relationships across the Lifespan by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy