Arbitrary Modeling of TSVs for 3D Integrated Circuits

Nonfiction, Science & Nature, Technology, Electronics, Circuits
Cover of the book Arbitrary Modeling of TSVs for 3D Integrated Circuits by Khaled Salah, Yehea Ismail, Alaa El-Rouby, Springer International Publishing
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Author: Khaled Salah, Yehea Ismail, Alaa El-Rouby ISBN: 9783319076119
Publisher: Springer International Publishing Publication: August 21, 2014
Imprint: Springer Language: English
Author: Khaled Salah, Yehea Ismail, Alaa El-Rouby
ISBN: 9783319076119
Publisher: Springer International Publishing
Publication: August 21, 2014
Imprint: Springer
Language: English

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

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