Microelectronics category: 225 books

Cover of Gallium Nitride Power Devices
by
Language: English
Release Date: July 6, 2017

GaN is considered the most promising material candidate in next-generation power device applications, owing to its unique material properties, for example, bandgap, high breakdown field, and high electron mobility. Therefore, GaN power device technologies are listed as the top priority to be developed...
Cover of Biomolecular Electronics

Biomolecular Electronics

Bioelectronics and the Electrical Control of Biological Systems and Reactions

by Paolo Facci
Language: English
Release Date: April 3, 2014

Biomolecular Electronics – the electrical control of biological phenomena – is a scientific challenge that, once fully realized, will find a wide range of applications from electronics and computing to medicine and therapeutic techniques. This new arena of biomolecular electronics is approached...
Cover of Nanophysics and Nanotechnology

Nanophysics and Nanotechnology

An Introduction to Modern Concepts in Nanoscience

by Edward L. Wolf
Language: English
Release Date: July 23, 2015

Long awaited new edition of this highly successful textbook, provides once more a unique introduction to the concepts, techniques and applications of nanoscale systems by covering its entire spectrum up to recent findings on graphene.
Cover of 半導體製程: 微影與蝕刻

半導體製程: 微影與蝕刻

Semiconductor Process Lithography and Etch

by Kung Linliu
Language: English
Release Date: June 7, 2018

作者:林劉恭 博士 2017年台灣半導體的年產值約為~ 2.46兆元台幣。2兆元台幣產值代表甚麼意義呢? 全球半導體的年產值約為12.366兆元台幣,同年美國半導體的年產值約為~ 2.65兆元台幣,日本半導體的年產值約為~ 1.1兆元台幣,台灣在這個產業的地位在何處呢? "黑天鵝效應”作者塔雷伯(Nassim...
Cover of Nanoelectromechanical Systems
by Laurent Duraffourg, Julien Arcamone
Language: English
Release Date: June 2, 2015

This book will present the theoretical and technological elements of nanosystems. Among the different topics discussed, the authors include the electromechanical properties of NEMS, the scaling effects that give these their interesting properties for different applications and the current manufacturing...
Cover of From Additive Manufacturing to 3D/4D Printing 2

From Additive Manufacturing to 3D/4D Printing 2

Current Techniques, Improvements and their Limitations

by Jean-Claude André
Language: English
Release Date: October 30, 2017

Additive manufacturing, which was first invented in France and then applied in the United States, is now 33 years old and represents a market of around 5 billion euros per year, with annual growth of between 20 and 30%. Today, additive manufacturing is experiencing a great amount of innovation in...
Cover of Smart SOA Platforms in Cloud Computing Architectures
by Codé Diop, Ernesto Exposito
Language: English
Release Date: July 9, 2014

This book is intended to introduce the principles of the Event-Driven and Service-Oriented Architecture (SOA 2.0) and its role in the new interconnected world based on the cloud computing architecture paradigm. In this new context, the concept of “service” is widely applied to the hardware and...
Cover of MEMS and NEMS

MEMS and NEMS

Systems, Devices, and Structures

by Sergey Edward Lyshevski
Language: English
Release Date: October 3, 2018

The development of micro- and nano-mechanical systems (MEMS and NEMS) foreshadows momentous changes not only in the technological world, but in virtually every aspect of human life. The future of the field is bright with opportunities, but also riddled with challenges, ranging from further theoretical...
Cover of Nano- and Micro-Electromechanical Systems

Nano- and Micro-Electromechanical Systems

Fundamentals of Nano- and Microengineering, Second Edition

by Sergey Edward Lyshevski
Language: English
Release Date: October 3, 2018

Society is approaching and advancing nano- and microtechnology from various angles of science and engineering. The need for further fundamental, applied, and experimental research is matched by the demand for quality references that capture the multidisciplinary and multifaceted nature of the science. Presenting...
Cover of Semiconductors

Semiconductors

Integrated Circuit Design for Manufacturability

by Artur Balasinski
Language: English
Release Date: September 3, 2018

Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger...
Cover of Network-on-Chip

Network-on-Chip

The Next Generation of System-on-Chip Integration

by Santanu Kundu, Santanu Chattopadhyay
Language: English
Release Date: September 3, 2018

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers...
Cover of Silicon Technologies

Silicon Technologies

Ion Implantation and Thermal Treatment

by
Language: English
Release Date: May 10, 2013

The main purpose of this book is to remind new engineers in silicon foundry, the fundamental physical and chemical rules in major Front end treatments: oxidation, epitaxy, ion implantation and impurities diffusion.
Cover of Micro Mechanical Transducers

Micro Mechanical Transducers

Pressure Sensors, Accelerometers and Gyroscopes

by Min-hang Bao
Language: English
Release Date: October 16, 2000

Some years ago, silicon-based mechanical sensors, like pressure sensors, accelerometers and gyroscopes, started their successful advance. Every year, hundreds of millions of these devices are sold, mainly for medical and automotive applications. The airbag sensor on which research already started...
Cover of Nanoscale Devices

Nanoscale Devices

Physics, Modeling, and Their Application

by Brajesh Kumar Kaushik
Language: English
Release Date: November 16, 2018

The primary aim of this book is to discuss various aspects of nanoscale device design and their applications including transport mechanism, modeling, and circuit applications. Furthermore, the book develops a strong foundation to understand the need for moving from conventional MOSFET to novel devices, including,...
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