Qingke Zhang: 1 book
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Language: English
Release Date: October 31, 2015
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are...
