Seonho Seok: 1 book
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Language: English
Release Date: April 27, 2018
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding...
