Xing Chang Wei: 1 book
by Xing-Chang Wei
Language: English
Release Date: September 19, 2017
Language: English
Release Date: September 19, 2017
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal...
