Compact Models and Performance Investigations for Subthreshold Interconnects

Nonfiction, Science & Nature, Technology, Electronics, Circuits
Cover of the book Compact Models and Performance Investigations for Subthreshold Interconnects by Rohit Dhiman, Rajeevan Chandel, Springer India
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Rohit Dhiman, Rajeevan Chandel ISBN: 9788132221326
Publisher: Springer India Publication: November 7, 2014
Imprint: Springer Language: English
Author: Rohit Dhiman, Rajeevan Chandel
ISBN: 9788132221326
Publisher: Springer India
Publication: November 7, 2014
Imprint: Springer
Language: English

The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.

More books from Springer India

Cover of the book Recent Trends in Antifungal Agents and Antifungal Therapy by Rohit Dhiman, Rajeevan Chandel
Cover of the book Mastering Endothelial Keratoplasty by Rohit Dhiman, Rajeevan Chandel
Cover of the book Getting Started with Tiva ARM Cortex M4 Microcontrollers by Rohit Dhiman, Rajeevan Chandel
Cover of the book The Economic Partnership Between India and Taiwan in a Post-ECFA Ecosystem by Rohit Dhiman, Rajeevan Chandel
Cover of the book PlantOmics: The Omics of Plant Science by Rohit Dhiman, Rajeevan Chandel
Cover of the book Clinical Rounds in Endocrinology by Rohit Dhiman, Rajeevan Chandel
Cover of the book Atlas of Head and Neck Cancer Surgery by Rohit Dhiman, Rajeevan Chandel
Cover of the book Mantras for Managers by Rohit Dhiman, Rajeevan Chandel
Cover of the book Advances in Bioethanol by Rohit Dhiman, Rajeevan Chandel
Cover of the book Microbial Inoculants in Sustainable Agricultural Productivity by Rohit Dhiman, Rajeevan Chandel
Cover of the book Strategic Disaster Risk Management in Asia by Rohit Dhiman, Rajeevan Chandel
Cover of the book Productivity, Separability and Deprivation by Rohit Dhiman, Rajeevan Chandel
Cover of the book Artificial Intelligence and Evolutionary Computations in Engineering Systems by Rohit Dhiman, Rajeevan Chandel
Cover of the book Omics for Personalized Medicine by Rohit Dhiman, Rajeevan Chandel
Cover of the book Cultural Ontology of the Self in Pain by Rohit Dhiman, Rajeevan Chandel
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy