Copper Electrodeposition for Nanofabrication of Electronics Devices

Nonfiction, Science & Nature, Technology, Nanotechnology, Science, Chemistry, Physical & Theoretical
Cover of the book Copper Electrodeposition for Nanofabrication of Electronics Devices by , Springer New York
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Author: ISBN: 9781461491767
Publisher: Springer New York Publication: November 20, 2013
Imprint: Springer Language: English
Author:
ISBN: 9781461491767
Publisher: Springer New York
Publication: November 20, 2013
Imprint: Springer
Language: English

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: • ULSI wiring material based upon copper nanowiring • Printed circuit boards • Stacked semiconductors • Through Silicon Via • Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

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