Design of 3D Integrated Circuits and Systems

Nonfiction, Science & Nature, Science, Physics, Thermodynamics, Technology, Electronics, Circuits, General Physics
Cover of the book Design of 3D Integrated Circuits and Systems by , CRC Press
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9781351831598
Publisher: CRC Press Publication: September 3, 2018
Imprint: CRC Press Language: English
Author:
ISBN: 9781351831598
Publisher: CRC Press
Publication: September 3, 2018
Imprint: CRC Press
Language: English

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity.

Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text:

  • Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer
  • Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs)
  • Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs)
  • Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications
  • Describes large-scale integration testing and state-of-the-art low-power testing solutions

Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference thatnot only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity.

Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text:

Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference thatnot only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

More books from CRC Press

Cover of the book Placenta Accreta Syndrome by
Cover of the book Underground Infrastructure of Urban Areas 4 by
Cover of the book Insider's Guide to Environmental Negotiation by
Cover of the book Project. Program. Change by
Cover of the book Force: Character Design from Life Drawing by
Cover of the book Microspheres: Medical and Biological Applications (1988) by
Cover of the book Rapid Revision in Clinical Pharmacology by
Cover of the book Regulating Information Asymmetry in the Residential Real Estate Market by
Cover of the book Environmental Impact of Water Resource Projects by
Cover of the book Gesture Drawing by
Cover of the book Gap Junction Channels and Hemichannels by
Cover of the book Regenerative Engineering and Developmental Biology by
Cover of the book Empirical Research for Software Security by
Cover of the book Real Estate in Italy by
Cover of the book Measurement, Instrumentation, and Sensors Handbook by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy