Designing TSVs for 3D Integrated Circuits

Nonfiction, Science & Nature, Technology, Electronics, Circuits, Computers, Advanced Computing, Engineering, Computer Architecture
Cover of the book Designing TSVs for 3D Integrated Circuits by Nauman Khan, Soha Hassoun, Springer New York
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Nauman Khan, Soha Hassoun ISBN: 9781461455080
Publisher: Springer New York Publication: September 22, 2012
Imprint: Springer Language: English
Author: Nauman Khan, Soha Hassoun
ISBN: 9781461455080
Publisher: Springer New York
Publication: September 22, 2012
Imprint: Springer
Language: English

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks.  Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks.  Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.

More books from Springer New York

Cover of the book Memory in Historical Perspective by Nauman Khan, Soha Hassoun
Cover of the book Protein Tyrosine Phosphatases in Cancer by Nauman Khan, Soha Hassoun
Cover of the book Advances in Nd:YAG Laser Surgery by Nauman Khan, Soha Hassoun
Cover of the book Informal Introduction to Stochastic Processes with Maple by Nauman Khan, Soha Hassoun
Cover of the book Health Services and Health Hazards: The Employee’s Need to Know by Nauman Khan, Soha Hassoun
Cover of the book Information Retrieval by Nauman Khan, Soha Hassoun
Cover of the book Addressing Unhealthy Alcohol Use in Primary Care by Nauman Khan, Soha Hassoun
Cover of the book Atlas of Implantable Therapies for Pain Management by Nauman Khan, Soha Hassoun
Cover of the book Information Systems Development by Nauman Khan, Soha Hassoun
Cover of the book Reviews of Environmental Contamination and Toxicology by Nauman Khan, Soha Hassoun
Cover of the book Patho-Epigenetics of Disease by Nauman Khan, Soha Hassoun
Cover of the book Fading and Shadowing in Wireless Systems by Nauman Khan, Soha Hassoun
Cover of the book The Fundamentals of Modern Astrophysics by Nauman Khan, Soha Hassoun
Cover of the book 20 Years of Computational Neuroscience by Nauman Khan, Soha Hassoun
Cover of the book Topical Directions of Informatics by Nauman Khan, Soha Hassoun
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy