Electronic Packaging Materials and Their Properties

Nonfiction, Science & Nature, Technology, Material Science, Electronics
Cover of the book Electronic Packaging Materials and Their Properties by Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan, CRC Press
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Author: Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan ISBN: 9781351830041
Publisher: CRC Press Publication: December 19, 2017
Imprint: CRC Press Language: English
Author: Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan
ISBN: 9781351830041
Publisher: CRC Press
Publication: December 19, 2017
Imprint: CRC Press
Language: English

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

interconnections

printed circuit boards

substrates

encapsulants

dielectrics

die attach materials

electrical contacts

thermal materials

solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.
Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:

interconnections

printed circuit boards

substrates

encapsulants

dielectrics

die attach materials

electrical contacts

thermal materials

solders
Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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