Author: | Xiaohong Chen, Yiu-Wing Mai | ISBN: | 9781908977205 |
Publisher: | World Scientific Publishing Company | Publication: | September 28, 2012 |
Imprint: | ICP | Language: | English |
Author: | Xiaohong Chen, Yiu-Wing Mai |
ISBN: | 9781908977205 |
Publisher: | World Scientific Publishing Company |
Publication: | September 28, 2012 |
Imprint: | ICP |
Language: | English |
Fracture Mechanics of Electromagnetic Materials provides a comprehensive overview of fracture mechanics of conservative and dissipative materials, as well as a general formulation of nonlinear field theory of fracture mechanics and a rigorous treatment of dynamic crack problems involving coupled magnetic, electric, thermal and mechanical field quantities.
Thorough emphasis is placed on the physical interpretation of fundamental concepts, development of theoretical models and exploration of their applications to fracture characterization in the presence of magneto-electro-thermo-mechanical coupling and dissipative effects. Mechanical, aeronautical, civil, biomedical, electrical and electronic engineers interested in application of the principles of fracture mechanics to design analysis and durability evaluation of smart structures and devices will find this book an invaluable resource.
Contents:
Readership: Graduate students, academic researchers and engineering specialists in fracture mechanics.
Key Features:
Fracture Mechanics of Electromagnetic Materials provides a comprehensive overview of fracture mechanics of conservative and dissipative materials, as well as a general formulation of nonlinear field theory of fracture mechanics and a rigorous treatment of dynamic crack problems involving coupled magnetic, electric, thermal and mechanical field quantities.
Thorough emphasis is placed on the physical interpretation of fundamental concepts, development of theoretical models and exploration of their applications to fracture characterization in the presence of magneto-electro-thermo-mechanical coupling and dissipative effects. Mechanical, aeronautical, civil, biomedical, electrical and electronic engineers interested in application of the principles of fracture mechanics to design analysis and durability evaluation of smart structures and devices will find this book an invaluable resource.
Contents:
Readership: Graduate students, academic researchers and engineering specialists in fracture mechanics.
Key Features: