Fundamentals of Lead-Free Solder Interconnect Technology

From Microstructures to Reliability

Nonfiction, Science & Nature, Technology, Material Science, Electronics
Cover of the book Fundamentals of Lead-Free Solder Interconnect Technology by Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma, Springer US
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Author: Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma ISBN: 9781461492665
Publisher: Springer US Publication: November 5, 2014
Imprint: Springer Language: English
Author: Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
ISBN: 9781461492665
Publisher: Springer US
Publication: November 5, 2014
Imprint: Springer
Language: English

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

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