Heterogeneous Integrations

Nonfiction, Science & Nature, Technology, Electronics, Circuits
Cover of the book Heterogeneous Integrations by John H. Lau, Springer Singapore
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: John H. Lau ISBN: 9789811372247
Publisher: Springer Singapore Publication: April 3, 2019
Imprint: Springer Language: English
Author: John H. Lau
ISBN: 9789811372247
Publisher: Springer Singapore
Publication: April 3, 2019
Imprint: Springer
Language: English

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

More books from Springer Singapore

Cover of the book Applications and Techniques in Information Security by John H. Lau
Cover of the book Research into Design for Communities, Volume 1 by John H. Lau
Cover of the book New Ecology for Education — Communication X Learning by John H. Lau
Cover of the book Avian Reproduction by John H. Lau
Cover of the book Methods and Applications for Modeling and Simulation of Complex Systems by John H. Lau
Cover of the book Residual Stresses and Nanoindentation Testing of Films and Coatings by John H. Lau
Cover of the book Next-Generation Networks by John H. Lau
Cover of the book Basic and Applied Phytoplankton Biology by John H. Lau
Cover of the book Innovations in Infrastructure by John H. Lau
Cover of the book Sustainable Membrane Technology for Water and Wastewater Treatment by John H. Lau
Cover of the book Current Concepts in Endometrial Cancer by John H. Lau
Cover of the book Transforming Education by John H. Lau
Cover of the book Brassinosteroids: Plant Growth and Development by John H. Lau
Cover of the book Cases of Mathematics Professional Development in East Asian Countries by John H. Lau
Cover of the book Calculus for Cognitive Scientists by John H. Lau
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy