Author: | ISBN: | 9783319089942 | |
Publisher: | Springer International Publishing | Publication: | October 29, 2014 |
Imprint: | Springer | Language: | English |
Author: | |
ISBN: | 9783319089942 |
Publisher: | Springer International Publishing |
Publication: | October 29, 2014 |
Imprint: | Springer |
Language: | English |
This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today’s most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (“become hot”), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.
This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today’s most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (“become hot”), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.