Lead-Free Solder Process Development

Nonfiction, Science & Nature, Technology, Material Science
Cover of the book Lead-Free Solder Process Development by , Wiley
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9781118102749
Publisher: Wiley Publication: March 29, 2011
Imprint: Wiley-IEEE Press Language: English
Author:
ISBN: 9781118102749
Publisher: Wiley
Publication: March 29, 2011
Imprint: Wiley-IEEE Press
Language: English

Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks

This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.

  • Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution
  • Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)
  • Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)
  • Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers

Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks

This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described.

Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

More books from Wiley

Cover of the book Home Staging For Dummies by
Cover of the book A Practical Guide to Vulval Disease by
Cover of the book Open Leadership by
Cover of the book Grundlagen der Elektronenspektroskopie by
Cover of the book Common Purpose by
Cover of the book Adaptive Asset Allocation by
Cover of the book Climate Change Impacts on Freshwater Ecosystems by
Cover of the book Business Model You by
Cover of the book Power Questions by
Cover of the book Computational Approaches in Biomedical Nano-Engineering by
Cover of the book Professional Embedded ARM Development by
Cover of the book Evidence-Based Nursing by
Cover of the book How to Become Filthy, Stinking Rich Through Network Marketing by
Cover of the book The Philosophy of Physics by
Cover of the book Fungi by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy