Lead-free Solders

Materials Reliability for Electronics

Nonfiction, Science & Nature, Technology, Material Science
Cover of the book Lead-free Solders by , Wiley
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Author: ISBN: 9781119966807
Publisher: Wiley Publication: March 6, 2012
Imprint: Wiley Language: English
Author:
ISBN: 9781119966807
Publisher: Wiley
Publication: March 6, 2012
Imprint: Wiley
Language: English

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:

  • Phase diagrams and alloy development
  • Effect of minor alloying additions
  • Composite approaches including nanoscale reinforcements
  • Mechanical issues affecting reliability
  • Reliability under impact loading
  • Thermomechanical fatigue
  • Chemical issues affecting reliability
  • Whisker growth
  • Electromigration
  • Thermomigration

Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:

Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

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