Materials for Electronic Packaging

Nonfiction, Science & Nature, Technology, Industrial Design, Electronics
Cover of the book Materials for Electronic Packaging by Deborah D.L. Chung, Elsevier Science
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Deborah D.L. Chung ISBN: 9780080511177
Publisher: Elsevier Science Publication: March 31, 1995
Imprint: Butterworth-Heinemann Language: English
Author: Deborah D.L. Chung
ISBN: 9780080511177
Publisher: Elsevier Science
Publication: March 31, 1995
Imprint: Butterworth-Heinemann
Language: English

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

  • Consists of 16 self-contained chapters, contributed by a variety of active researchers from industrial, academic and governmental sectors
  • Addresses the need of materials scientists/engineers, electrical engineers, mechanical engineers, physicists and chemists to acquire a thorough knowledge of materials science
  • Explains how the materials for electronic packaging determine the overall effectiveness of electronic systems
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

More books from Elsevier Science

Cover of the book Personality Development Across the Lifespan by Deborah D.L. Chung
Cover of the book Stimuli Responsive Polymeric Membranes by Deborah D.L. Chung
Cover of the book Advances in Asymmetric Autocatalysis and Related Topics by Deborah D.L. Chung
Cover of the book Advances in Agronomy by Deborah D.L. Chung
Cover of the book Architecting High Performing, Scalable and Available Enterprise Web Applications by Deborah D.L. Chung
Cover of the book Biophysical, Chemical, and Functional Probes of RNA Structure, Interactions and Folding: Part A by Deborah D.L. Chung
Cover of the book Pressure Retarded Osmosis by Deborah D.L. Chung
Cover of the book Solution Focused Anxiety Management by Deborah D.L. Chung
Cover of the book Social Anxiety by Deborah D.L. Chung
Cover of the book Postharvest Diseases of Fruits and Vegetables by Deborah D.L. Chung
Cover of the book Heterogeneous Catalysis by Deborah D.L. Chung
Cover of the book Studies in Natural Products Chemistry by Deborah D.L. Chung
Cover of the book High-Temperature Solid Oxide Fuel Cells for the 21st Century by Deborah D.L. Chung
Cover of the book A Practical Guide to the Study of Calcium in Living Cells by Deborah D.L. Chung
Cover of the book Telecommunications Law in the Internet Age by Deborah D.L. Chung
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy