More-than-Moore 2.5D and 3D SiP Integration

Nonfiction, Science & Nature, Technology, Electronics, Circuits, Computers, Advanced Computing, Engineering, Computer Architecture
Cover of the book More-than-Moore 2.5D and 3D SiP Integration by Riko Radojcic, Springer International Publishing
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Riko Radojcic ISBN: 9783319525488
Publisher: Springer International Publishing Publication: February 8, 2017
Imprint: Springer Language: English
Author: Riko Radojcic
ISBN: 9783319525488
Publisher: Springer International Publishing
Publication: February 8, 2017
Imprint: Springer
Language: English

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.  

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.  

More books from Springer International Publishing

Cover of the book Politics and Bureaucracy in the Norwegian Welfare State by Riko Radojcic
Cover of the book Diverse Voices of Disabled Sexualities in the Global South by Riko Radojcic
Cover of the book Towards a Code of Ethics for Artificial Intelligence by Riko Radojcic
Cover of the book Testing of Interposer-Based 2.5D Integrated Circuits by Riko Radojcic
Cover of the book Reducing Inequalities by Riko Radojcic
Cover of the book Advances and Applications in Geospatial Technology and Earth Resources by Riko Radojcic
Cover of the book Rhetoric and the Global Turn in Higher Education by Riko Radojcic
Cover of the book Building for a Sustainable Future in Our Schools by Riko Radojcic
Cover of the book Measuring Youth Well-being by Riko Radojcic
Cover of the book Queering Childhood in Early Modern English Drama and Culture by Riko Radojcic
Cover of the book Machine Tool Metrology by Riko Radojcic
Cover of the book Atlas of Cardiac Innervation by Riko Radojcic
Cover of the book Hip Hop, Hegel, and the Art of Emancipation by Riko Radojcic
Cover of the book Confectionery Science and Technology by Riko Radojcic
Cover of the book New Data Structures and Algorithms for Logic Synthesis and Verification by Riko Radojcic
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy