More-than-Moore 2.5D and 3D SiP Integration

Nonfiction, Science & Nature, Technology, Electronics, Circuits, Computers, Advanced Computing, Engineering, Computer Architecture
Cover of the book More-than-Moore 2.5D and 3D SiP Integration by Riko Radojcic, Springer International Publishing
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Author: Riko Radojcic ISBN: 9783319525488
Publisher: Springer International Publishing Publication: February 8, 2017
Imprint: Springer Language: English
Author: Riko Radojcic
ISBN: 9783319525488
Publisher: Springer International Publishing
Publication: February 8, 2017
Imprint: Springer
Language: English

This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.  

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This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.  

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