Nanopackaging

Nanotechnologies and Electronics Packaging

Nonfiction, Science & Nature, Technology, Nanotechnology, Science, Chemistry, Physical & Theoretical
Cover of the book Nanopackaging by , Springer US
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9780387473260
Publisher: Springer US Publication: December 30, 2008
Imprint: Springer Language: English
Author:
ISBN: 9780387473260
Publisher: Springer US
Publication: December 30, 2008
Imprint: Springer
Language: English

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

More books from Springer US

Cover of the book The TEACCH Approach to Autism Spectrum Disorders by
Cover of the book Special Education Law by
Cover of the book The Group Effect by
Cover of the book Current Perspectives in Hepatology by
Cover of the book Cardiac Surgery by
Cover of the book Biology of Earthworms by
Cover of the book Medical Neuropsychology by
Cover of the book Clostridia by
Cover of the book Interferon Alpha-2: Pre-Clinical and Clinical Evaluation by
Cover of the book Document Computing by
Cover of the book Preventing Youth Problems by
Cover of the book Cross-Cultural Risk Perception by
Cover of the book Apple IIc and IIe Assembly Language by
Cover of the book Laboratory Guide to Biochemistry, Enzymology, and Protein Physical Chemistry by
Cover of the book Cardiovascular Physiology in the Genetically Engineered Mouse by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy