Photonic Packaging Sourcebook

Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules

Nonfiction, Science & Nature, Technology, Microwaves, Nanotechnology
Cover of the book Photonic Packaging Sourcebook by Ulrich H. P. Fischer-Hirchert, Springer Berlin Heidelberg
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Ulrich H. P. Fischer-Hirchert ISBN: 9783642253768
Publisher: Springer Berlin Heidelberg Publication: April 11, 2015
Imprint: Springer Language: English
Author: Ulrich H. P. Fischer-Hirchert
ISBN: 9783642253768
Publisher: Springer Berlin Heidelberg
Publication: April 11, 2015
Imprint: Springer
Language: English

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

More books from Springer Berlin Heidelberg

Cover of the book Diagnostics of Vascular Diseases by Ulrich H. P. Fischer-Hirchert
Cover of the book Eye Pathology by Ulrich H. P. Fischer-Hirchert
Cover of the book Globalization, Economic Growth and Innovation Dynamics by Ulrich H. P. Fischer-Hirchert
Cover of the book Promoting Sustainable Innovations in Plant Varieties by Ulrich H. P. Fischer-Hirchert
Cover of the book Produkteinführung by Ulrich H. P. Fischer-Hirchert
Cover of the book Water in the Middle East and in North Africa by Ulrich H. P. Fischer-Hirchert
Cover of the book Keratoprostheses and Artificial Corneas by Ulrich H. P. Fischer-Hirchert
Cover of the book Cosmic Rays in Star-Forming Environments by Ulrich H. P. Fischer-Hirchert
Cover of the book Technological Competition, Employment and Innovation Policies in OECD Countries by Ulrich H. P. Fischer-Hirchert
Cover of the book Brain Failure by Ulrich H. P. Fischer-Hirchert
Cover of the book Unique Radio Innovation for the 21st Century by Ulrich H. P. Fischer-Hirchert
Cover of the book TYPIX Standardized Data and Crystal Chemical Characterization of Inorganic Structure Types by Ulrich H. P. Fischer-Hirchert
Cover of the book Petrogenesis of Metamorphic Rocks by Ulrich H. P. Fischer-Hirchert
Cover of the book Entwurf integrierter 3D-Systeme der Elektronik by Ulrich H. P. Fischer-Hirchert
Cover of the book Prehistoric Human Bone by Ulrich H. P. Fischer-Hirchert
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy