Poly-SiGe for MEMS-above-CMOS Sensors

Nonfiction, Science & Nature, Technology, Material Science, Electronics, Circuits
Cover of the book Poly-SiGe for MEMS-above-CMOS Sensors by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw, Springer Netherlands
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw ISBN: 9789400767997
Publisher: Springer Netherlands Publication: July 17, 2013
Imprint: Springer Language: English
Author: Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
ISBN: 9789400767997
Publisher: Springer Netherlands
Publication: July 17, 2013
Imprint: Springer
Language: English

Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability.

Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence of deposition conditions, germanium content and doping concentration on the electrical and piezoresistive properties of boron-doped poly-SiGe. The development of a CMOS-compatible process flow, with special attention to the sealing method, is also described. Piezoresistive pressure sensors with different areas and piezoresistor designs were fabricated and tested. Together with the piezoresistive pressure sensors, also functional capacitive pressure sensors were successfully fabricated on the same wafer, proving the versatility of poly-SiGe for MEMS sensor applications. Finally, a detailed analysis of the MEMS processing impact on the underlying CMOS circuit is also presented.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability.

Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence of deposition conditions, germanium content and doping concentration on the electrical and piezoresistive properties of boron-doped poly-SiGe. The development of a CMOS-compatible process flow, with special attention to the sealing method, is also described. Piezoresistive pressure sensors with different areas and piezoresistor designs were fabricated and tested. Together with the piezoresistive pressure sensors, also functional capacitive pressure sensors were successfully fabricated on the same wafer, proving the versatility of poly-SiGe for MEMS sensor applications. Finally, a detailed analysis of the MEMS processing impact on the underlying CMOS circuit is also presented.

More books from Springer Netherlands

Cover of the book Medical Challenges for the New Millennium by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book The Future of the Law of the Sea by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book Reading Engelhardt by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book The Physics and Chemistry of Inorganic Clathrates by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book East-West Scientific Co-operation by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book Handbook of Legal Reasoning and Argumentation by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book Lake Kivu by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book Epistemology versus Ontology by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book Phenomenology and Dialectical Materialism by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book The Ethics of Legal Coercion by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book The Demographic Transition and Development in Africa by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book Responsibility and Punishment by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book Education for Self-transformation by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book On the Existence of God by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
Cover of the book The Mucosal Immune System by Pilar Gonzalez Ruiz, Kristin De Meyer, Ann Witvrouw
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy