Product Lifecycle Management in the Era of Internet of Things
12th IFIP WG 5.1 International Conference, PLM 2015, Doha, Qatar, October 19-21, 2015, Revised Selected Papers
Nonfiction, Computers, Application Software, CAD/CAM, Business & Finance, Industries & Professions, Information Management, General Computing
| Author: | ISBN: | 9783319331119 | |
| Publisher: | Springer International Publishing | Publication: | April 20, 2016 |
| Imprint: | Springer | Language: | English |
| Author: | |
| ISBN: | 9783319331119 |
| Publisher: | Springer International Publishing |
| Publication: | April 20, 2016 |
| Imprint: | Springer |
| Language: | English |
This book constitutes the refereed proceedings of the 12th IFIP WG 5.1 International Conference on Product Lifecycle Management, PLM 2015, held in Doha, Qatar, in October 2015.
The 79 revised full papers were carefully reviewed and selected from 130 submissions. The papers are organized in the following topical sections: smart products, assessment approaches, PLM maturity, building information modeling (BIM), languages and ontologies, product service systems, future factory, knowledge creation and management, simulation and virtual environments, sustainability and systems improvement, configuration and engineering change, education studies, cyber-physical and smart systems, design and integration issues, and PLM processes and applications.
This book constitutes the refereed proceedings of the 12th IFIP WG 5.1 International Conference on Product Lifecycle Management, PLM 2015, held in Doha, Qatar, in October 2015.
The 79 revised full papers were carefully reviewed and selected from 130 submissions. The papers are organized in the following topical sections: smart products, assessment approaches, PLM maturity, building information modeling (BIM), languages and ontologies, product service systems, future factory, knowledge creation and management, simulation and virtual environments, sustainability and systems improvement, configuration and engineering change, education studies, cyber-physical and smart systems, design and integration issues, and PLM processes and applications.
