Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Nonfiction, Science & Nature, Technology, Telecommunications
Cover of the book Reliability of RoHS-Compliant 2D and 3D IC Interconnects by John H. Lau, McGraw-Hill Education
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: John H. Lau ISBN: 9780071753807
Publisher: McGraw-Hill Education Publication: October 22, 2010
Imprint: McGraw-Hill Education Language: English
Author: John H. Lau
ISBN: 9780071753807
Publisher: McGraw-Hill Education
Publication: October 22, 2010
Imprint: McGraw-Hill Education
Language: English

Proven 2D and 3D IC lead-free interconnect reliability techniques

Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.

Covers reliability of:

  • 2D and 3D IC lead-free interconnects
  • CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints
  • Lead-free (SACX) solder joints
  • Low-temperature lead-free (SnBiAg) solder joints
  • Solder joints with voids, high strain rate, and high ramp rate
  • VCSEL and LED lead-free interconnects
  • 3D LED and 3D MEMS with TSVs
  • Chip-to-wafer (C2W) bonding and lead-free interconnects
  • Wafer-to-wafer (W2W) bonding and lead-free interconnects
  • 3D IC chip stacking with low-temperature bonding
  • TSV interposers and lead-free interconnects
  • Electromigration of lead-free microbumps for 3D IC integration
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Proven 2D and 3D IC lead-free interconnect reliability techniques

Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.

Covers reliability of:

More books from McGraw-Hill Education

Cover of the book What is Lean Six Sigma by John H. Lau
Cover of the book Industrial Automation: Hands On by John H. Lau
Cover of the book Conquering Complexity in Your Business: How Wal-Mart, Toyota, and Other Top Companies Are Breaking Through the Ceiling on Profits and Growth by John H. Lau
Cover of the book Lectures on the New Education by John H. Lau
Cover of the book Microsoft XNA Game Studio Creator's Guide, Second Edition by John H. Lau
Cover of the book Official GRE Verbal Reasoning Practice Questions by John H. Lau
Cover of the book Mastering the Currency Market: Forex Strategies for High and Low Volatility Markets by John H. Lau
Cover of the book Too Smart for Our Own Good: Ingenious Investment Strategies, Illusions of Safety, and Market Crashes by John H. Lau
Cover of the book First Aid Cases for the USMLE Step 1, Third Edition by John H. Lau
Cover of the book Schaum's Outline of Intermediate Accounting II, 2ed by John H. Lau
Cover of the book How to Solve Physics Problems by John H. Lau
Cover of the book 5 Steps to a 5 AP Psychology Flashcards by John H. Lau
Cover of the book The Power of Strategic Thinking: Lock In Markets, Lock Out Competitors by John H. Lau
Cover of the book Electrician''s Guide to Control and Monitoring Systems: Installation, Troubleshooting, and Maintenance by John H. Lau
Cover of the book Practice Makes Perfect: French Verb Tenses by John H. Lau
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy