RF and Microwave Microelectronics Packaging
Nonfiction, Science & Nature, Technology, Microwaves, Electronics
| Author: | ISBN: | 9781441909848 | |
| Publisher: | Springer US | Publication: | December 1, 2009 |
| Imprint: | Springer | Language: | English |
| Author: | |
| ISBN: | 9781441909848 |
| Publisher: | Springer US |
| Publication: | December 1, 2009 |
| Imprint: | Springer |
| Language: | English |
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
