Thermal Stress and Strain in Microelectronics Packaging

Nonfiction, Science & Nature, Technology, Electronics, Science
Cover of the book Thermal Stress and Strain in Microelectronics Packaging by , Springer US
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: ISBN: 9781468477672
Publisher: Springer US Publication: December 6, 2012
Imprint: Springer Language: English
Author:
ISBN: 9781468477672
Publisher: Springer US
Publication: December 6, 2012
Imprint: Springer
Language: English

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat­ ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec­ tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat­ ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec­ tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

More books from Springer US

Cover of the book Risk Assessment Methods by
Cover of the book Malignant Melanoma 1 by
Cover of the book Recent Developments in Alcoholism by
Cover of the book ICTs and the Millennium Development Goals by
Cover of the book Rheology of Fluid, Semisolid, and Solid Foods by
Cover of the book Therapy for Genitourinary Cancer by
Cover of the book Soft Errors in Modern Electronic Systems by
Cover of the book Modern Accelerator Technologies for Geographic Information Science by
Cover of the book The Practical Handbook of Computerization for Distribution Managers by
Cover of the book Quantum Attacks on Public-Key Cryptosystems by
Cover of the book Acute Coronary Care 1986 by
Cover of the book The Social and Economic Impact of New Technology 1978–84: A Select Bibliography by
Cover of the book Hypoxia by
Cover of the book Synchronized Phasor Measurements and Their Applications by
Cover of the book Engineering Approaches to Mechanical and Robotic Design for Minimally Invasive Surgery (MIS) by
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy