Three-Dimensional Integration of Semiconductors

Processing, Materials, and Applications

Nonfiction, Science & Nature, Science, Chemistry, Physical & Theoretical, Technology, Electricity
Cover of the book Three-Dimensional Integration of Semiconductors by , Springer International Publishing
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Author: ISBN: 9783319186757
Publisher: Springer International Publishing Publication: December 9, 2015
Imprint: Springer Language: English
Author:
ISBN: 9783319186757
Publisher: Springer International Publishing
Publication: December 9, 2015
Imprint: Springer
Language: English

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

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