Through-Silicon Vias for 3D Integration

Nonfiction, Science & Nature, Technology, Nanotechnology, Electronics, Circuits, Telecommunications
Cover of the book Through-Silicon Vias for 3D Integration by John H. Lau, McGraw-Hill Education
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Author: John H. Lau ISBN: 9780071785150
Publisher: McGraw-Hill Education Publication: August 5, 2012
Imprint: McGraw-Hill Education Language: English
Author: John H. Lau
ISBN: 9780071785150
Publisher: McGraw-Hill Education
Publication: August 5, 2012
Imprint: McGraw-Hill Education
Language: English

A comprehensive guide to TSV and other enabling technologies for 3D integration

Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.

This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.

Coverage includes:

  • Nanotechnology and 3D integration for the semiconductor industry
  • TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing
  • TSVs: mechanical, thermal, and electrical behaviors
  • Thin-wafer strength measurement
  • Wafer thinning and thin-wafer handling
  • Microbumping, assembly, and reliability
  • Microbump electromigration
  • Transient liquid-phase bonding: C2C, C2W, and W2W
  • 2.5D IC integration with interposers
  • 3D IC integration with interposers
  • Thermal management of 3D IC integration
  • 3D IC packaging
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

A comprehensive guide to TSV and other enabling technologies for 3D integration

Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.

This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.

Coverage includes:

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