VLSI-SoC: Internet of Things Foundations

22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, Playa del Carmen, Mexico, October 6-8, 2014, Revised Selected Papers

Nonfiction, Computers, Application Software, CAD/CAM, Computer Hardware, Input-Output Equipment, General Computing
Cover of the book VLSI-SoC: Internet of Things Foundations by , Springer International Publishing
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Author: ISBN: 9783319252797
Publisher: Springer International Publishing Publication: October 2, 2015
Imprint: Springer Language: English
Author:
ISBN: 9783319252797
Publisher: Springer International Publishing
Publication: October 2, 2015
Imprint: Springer
Language: English

This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

This book contains extended and revised versions of the best papers presented at the 22nd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2014, held in Playa del Carmen, Mexico, in October 2014. The 12 papers included in the book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of these systems.

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