Wafer Level 3-D ICs Process Technology

Nonfiction, Science & Nature, Technology, Material Science, Electronics
Cover of the book Wafer Level 3-D ICs Process Technology by , Springer US
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Author: ISBN: 9780387765341
Publisher: Springer US Publication: June 29, 2009
Imprint: Springer Language: English
Author:
ISBN: 9780387765341
Publisher: Springer US
Publication: June 29, 2009
Imprint: Springer
Language: English

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

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