3D IC Integration and Packaging

Nonfiction, Science & Nature, Technology, Electronics, Optoelectronics, Semiconductors, Electricity
Cover of the book 3D IC Integration and Packaging by John H. Lau, McGraw-Hill Education
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Author: John H. Lau ISBN: 9780071848077
Publisher: McGraw-Hill Education Publication: July 6, 2015
Imprint: McGraw-Hill Education Language: English
Author: John H. Lau
ISBN: 9780071848077
Publisher: McGraw-Hill Education
Publication: July 6, 2015
Imprint: McGraw-Hill Education
Language: English

A comprehensive guide to 3D IC integration and packaging technology

3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.

3D IC Integration and Packaging covers:

• 3D integration for semiconductor IC packaging

• Through-silicon vias modeling and testing

• Stress sensors for thin-wafer handling and strength measurement

• Package substrate technologies

• Microbump fabrication, assembly, and reliability

• 3D Si integration

• 2.5D/3D IC integration

• 3D IC integration with passive interposer

• Thermal management of 2.5D/3D IC integration

• Embedded 3D hybrid integration

• 3D LED and IC integration

• 3D MEMS and IC integration

• 3D CMOS image sensors and IC integration

• PoP, chip-to-chip interconnects, and embedded fan-out WLP

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

A comprehensive guide to 3D IC integration and packaging technology

3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.

3D IC Integration and Packaging covers:

• 3D integration for semiconductor IC packaging

• Through-silicon vias modeling and testing

• Stress sensors for thin-wafer handling and strength measurement

• Package substrate technologies

• Microbump fabrication, assembly, and reliability

• 3D Si integration

• 2.5D/3D IC integration

• 3D IC integration with passive interposer

• Thermal management of 2.5D/3D IC integration

• Embedded 3D hybrid integration

• 3D LED and IC integration

• 3D MEMS and IC integration

• 3D CMOS image sensors and IC integration

• PoP, chip-to-chip interconnects, and embedded fan-out WLP

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