Advanced Flip Chip Packaging

Nonfiction, Science & Nature, Technology, Electronics, Circuits
Cover of the book Advanced Flip Chip Packaging by , Springer US
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Author: ISBN: 9781441957689
Publisher: Springer US Publication: March 20, 2013
Imprint: Springer Language: English
Author:
ISBN: 9781441957689
Publisher: Springer US
Publication: March 20, 2013
Imprint: Springer
Language: English

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.

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