Bonded Joints and Repairs to Composite Airframe Structures

Nonfiction, Science & Nature, Technology, Material Science, Aeronautics & Astronautics
Cover of the book Bonded Joints and Repairs to Composite Airframe Structures by Chun Hui Wang, Cong N. Duong, Elsevier Science
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Chun Hui Wang, Cong N. Duong ISBN: 9780124171725
Publisher: Elsevier Science Publication: October 10, 2015
Imprint: Academic Press Language: English
Author: Chun Hui Wang, Cong N. Duong
ISBN: 9780124171725
Publisher: Elsevier Science
Publication: October 10, 2015
Imprint: Academic Press
Language: English

Bonded Joints and Repairs to Composite Airframe Structures is a single-source reference on the state-of-the-art in this rapidly growing area. It provides a thorough analysis of both internal and external joints and repairs, as well as discussions on damage tolerance, non-destructive inspection, self-healing repairs, and other essential information not only on the joints and repairs themselves, but critically, on how they differ from bonds and repairs to metallic aircraft.

Authors Wang and Duong bring a valuable combination of academic research and industry expertise to the book, drawing on their cutting-edge composite technology experience, including analytic and computational leadership of damage and repair planning for the Boeing 787.

Intended for graduate students, engineers, and scientists working on the subject in aerospace industry, government agencies, research labs, and academia, the book is an important addition to the limited literature in the field.

  • Offers rare coverage of composite joints and repairs to composite structures, focusing on the state of the art in analysis
  • Combines the academic, government, and industry expertise of the authors, providing research findings in the context of current and future applications
  • Covers internal and external joints and repairs, as well as damage tolerance, non-destructive inspection, and self-healing repairs
  • Ideal for graduate students, engineers, and scientists working in the aerospace industry, government agencies, research labs, and academia
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Bonded Joints and Repairs to Composite Airframe Structures is a single-source reference on the state-of-the-art in this rapidly growing area. It provides a thorough analysis of both internal and external joints and repairs, as well as discussions on damage tolerance, non-destructive inspection, self-healing repairs, and other essential information not only on the joints and repairs themselves, but critically, on how they differ from bonds and repairs to metallic aircraft.

Authors Wang and Duong bring a valuable combination of academic research and industry expertise to the book, drawing on their cutting-edge composite technology experience, including analytic and computational leadership of damage and repair planning for the Boeing 787.

Intended for graduate students, engineers, and scientists working on the subject in aerospace industry, government agencies, research labs, and academia, the book is an important addition to the limited literature in the field.

More books from Elsevier Science

Cover of the book Characterization of Biomaterials by Chun Hui Wang, Cong N. Duong
Cover of the book Sedimentary Basins and Petroleum Geology of the Middle East by Chun Hui Wang, Cong N. Duong
Cover of the book Towards Nearly Zero Energy by Chun Hui Wang, Cong N. Duong
Cover of the book Seven Deadliest Social Network Attacks by Chun Hui Wang, Cong N. Duong
Cover of the book SAP Security Configuration and Deployment by Chun Hui Wang, Cong N. Duong
Cover of the book Genes and Evolution by Chun Hui Wang, Cong N. Duong
Cover of the book Data Architecture: A Primer for the Data Scientist by Chun Hui Wang, Cong N. Duong
Cover of the book Quality Management for the Technology Sector by Chun Hui Wang, Cong N. Duong
Cover of the book Biophysical, Chemical, and Functional Probes of RNA Structure, Interactions and Folding: Part B by Chun Hui Wang, Cong N. Duong
Cover of the book Applications of Random Process Excursion Analysis by Chun Hui Wang, Cong N. Duong
Cover of the book Pipeline Risk Management Manual by Chun Hui Wang, Cong N. Duong
Cover of the book Manufacturing Process Selection Handbook by Chun Hui Wang, Cong N. Duong
Cover of the book Bursting Neurons and Fading Memories by Chun Hui Wang, Cong N. Duong
Cover of the book Pericyclic Chemistry by Chun Hui Wang, Cong N. Duong
Cover of the book Practical NMR Spectroscopy Laboratory Guide: Using Bruker Spectrometers by Chun Hui Wang, Cong N. Duong
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy