Jing Wang: 19 books

Book cover of Dragons with Clay Feet?

Dragons with Clay Feet?

Transition, Sustainable Land Use, and Rural Environment in China and Vietnam

by Connie Chan-Kang, Cheng Zhigang, Nguyen Huu Dung
Language: English
Release Date: February 16, 2007

Dragons with Clay Feet? presents state-of-the-art research on the impact of ongoing and anticipated economic policy and institutional reforms on agricultural development and sustainable rural resource in two East-Asian transition (and developing) economies—China and Vietnam. The contributions to...
Book cover of Adaptive Backstepping Control of Uncertain Systems with Actuator Failures, Subsystem Interactions, and Nonsmooth Nonlinearities
by Wei Wang, Changyun Wen, Jing Zhou
Language: English
Release Date: September 18, 2017

In practice, actuators often undergo failures and various factors influence its effectiveness. Also due to the increasing complexity of large-scale systems, subsystems are often interconnected, whereas the interactions between any two subsystems are difficult to deal with. This book details a series...
Book cover of Hierarchical Protection for Smart Grids
by Jing Ma, Zengping Wang
Language: English
Release Date: April 4, 2018

A systematic view of hierarchical protection for smart grids, with solutions to tradition protection problems and complicated operation modes of modern power systems • Systematically investigates traditional protection problems from the bird’s eye view of hierarchical protection •...
Book cover of Haptic Rendering for Simulation of Fine Manipulation
by Dangxiao Wang, Jing Xiao, Yuru Zhang
Language: English
Release Date: October 17, 2014

This book introduces the latest progress in six degrees of freedom (6-DoF) haptic rendering with the focus on a new approach for simulating force/torque feedback in performing tasks that require dexterous manipulation skills. One of the major challenges in 6-DoF haptic rendering is to resolve the...
Book cover of Introduction to Microsystem Packaging Technology
by Yufeng Jin, Zhiping Wang, Jing Chen
Language: English
Release Date: December 19, 2017

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use...
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