Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses

Fundamental Mechanisms and Application to IC Interconnect Technology

Nonfiction, Science & Nature, Technology, Manufacturing, Electricity
Cover of the book Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann, Springer US
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart
Author: Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann ISBN: 9781461511656
Publisher: Springer US Publication: November 27, 2013
Imprint: Springer Language: English
Author: Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
ISBN: 9781461511656
Publisher: Springer US
Publication: November 27, 2013
Imprint: Springer
Language: English

As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials.

The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials.

The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.

More books from Springer US

Cover of the book Advances in Clinical Child Psychology by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Plague and Other Yersinia Infections by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Evolutionary Theory and Human Nature by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Heart Cell Coupling and Impulse Propagation in Health and Disease by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Conservation in the 21st Century: Gorillas as a Case Study by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Breast Cancer: Cellular and Molecular Biology by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Biopsychosocial Perspectives on Arab Americans by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Plant Cell and Tissue Culture for the Production of Food Ingredients by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Fundamentals of III-V Semiconductor MOSFETs by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Ovarian Cancer by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Issues in International Bilingual Education by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Designing Effective and Usable Multimedia Systems by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Information Hiding: Steganography and Watermarking-Attacks and Countermeasures by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book The Risks of Knowing by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
Cover of the book Impact of Natural Hazards on Oil and Gas Extraction by Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann
We use our own "cookies" and third party cookies to improve services and to see statistical information. By using this website, you agree to our Privacy Policy