Noise Coupling in System-on-Chip

Nonfiction, Science & Nature, Technology, Electronics, Microelectronics, Circuits, Electricity
Cover of the book Noise Coupling in System-on-Chip by , CRC Press
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Author: ISBN: 9781351642781
Publisher: CRC Press Publication: January 9, 2018
Imprint: CRC Press Language: English
Author:
ISBN: 9781351642781
Publisher: CRC Press
Publication: January 9, 2018
Imprint: CRC Press
Language: English

Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.

View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.

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