Testing of Interposer-Based 2.5D Integrated Circuits

Nonfiction, Science & Nature, Technology, Electronics, Circuits, Computers, Advanced Computing, Engineering, Computer Architecture
Cover of the book Testing of Interposer-Based 2.5D Integrated Circuits by Ran Wang, Krishnendu Chakrabarty, Springer International Publishing
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Author: Ran Wang, Krishnendu Chakrabarty ISBN: 9783319547145
Publisher: Springer International Publishing Publication: March 20, 2017
Imprint: Springer Language: English
Author: Ran Wang, Krishnendu Chakrabarty
ISBN: 9783319547145
Publisher: Springer International Publishing
Publication: March 20, 2017
Imprint: Springer
Language: English

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits.  The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.  This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

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This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits.  The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.  This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

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