Wire Bonding in Microelectronics

Nonfiction, Science & Nature, Technology, Telecommunications
Cover of the book Wire Bonding in Microelectronics by George Harman, McGraw-Hill Education
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Author: George Harman ISBN: 9780071642651
Publisher: McGraw-Hill Education Publication: June 5, 2009
Imprint: McGraw-Hill Education Language: English
Author: George Harman
ISBN: 9780071642651
Publisher: McGraw-Hill Education
Publication: June 5, 2009
Imprint: McGraw-Hill Education
Language: English

The Industry Standard Guide to Wire Bonding--Fully Updated

The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

  • Ultrasonic bonding systems and technologies, including high-frequency systems
  • Bonding wire metallurgy and characteristics, including copper wire
  • Wire bond testing
  • Gold-aluminum intermetallic compounds and other interface reactions
  • Gold and nickel-based bond pad plating materials and problems
  • Cleaning to improve bondability and reliability
  • Mechanical problems in wire bonding
  • High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds
  • Copper, low-dielectric-constant (Cu/Lo-k) technology and problems
  • Wire bonding process modeling and simulation
CD includes all the book's full-color figures plus animations
View on Amazon View on AbeBooks View on Kobo View on B.Depository View on eBay View on Walmart

The Industry Standard Guide to Wire Bonding--Fully Updated

The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.

COVERAGE INCLUDES:

CD includes all the book's full-color figures plus animations

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