Packaging of High Power Semiconductor Lasers

Nonfiction, Science & Nature, Technology, Power Resources
Cover of the book Packaging of High Power Semiconductor Lasers by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu, Springer New York
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Author: Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu ISBN: 9781461492634
Publisher: Springer New York Publication: July 14, 2014
Imprint: Springer Language: English
Author: Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu
ISBN: 9781461492634
Publisher: Springer New York
Publication: July 14, 2014
Imprint: Springer
Language: English

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

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